PRODUCTS / EMBEDDED FLASH

M.2 SSD

Introduction

M.2 SSD brings ultra-thin and light storage devices to a long-awaited Embedded market. These Flash NAND solutions address applications that require reliable data storage to applications in Smart IoT, Industrial, Networking, Embedded, and provide a rugged, cost-effective and dependable non-volatile memory solution. The M.2 allows legacy SATA to convert to a form factor with no driver change. The M.2 PCIe access to PCIe Express lanes to take advantage of the high data transfer needed on next-generation computational systems.

M.2 SSD

M.2 SATA

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M.2 PCIe GEN3 NVMe

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M.2 SATA

Key Features

  • Built-in Wear-Leveling and ECC
  • Industrial operation (-40°C to 85°C)
  • pSLC, SLC, MLC, and TLC NAND Technology for integrity
  • Up to 1TB
  • Three M.2 Form Factors: 2280, 2242
  • Power Loss Protection
  • S.M.A.R.T support for health monitoring
  • TRIM support
  • SLC caching and Direct to MLC mode

Benefits

  • Data Reliability
  • Optimized for Operation in Extreme Weather
  • Enhanced Endurance
  • Large Capacity
  • Legacy or New design in support
  • Data in Flight Integrity

Features & performance

Interface
Compatibility
User Capacity
Form Factor
NAND Channel (#)
NAND Type
Sequential Read/Write 128KB
Random Read/Write 4KB
HW PLP
PowerActive (Typ)
Features
Commercial Operating Temp
Industrial Operating Temp
Security
Error Correction
Mean Time Before Failure (MTBF)
Warranty

Specification

SATA III 6.0 Gb/s
SATA I, II, III Rev 3.2
pSLC: up to 256GB
SLC: up to 128GB
TLC: up to 512GB
M.2 2242
M.2 2280
x8, x4
pSLC, TLC
560/520 MB/s
100K/90K IOPs
No
Yes (2242)
TBD
TRIM, Global Wear Leveling, End to End data path protection, SMART, Bad Block Management, Direct-to-TLC and SLC Caching
0°C to 70°C
-40°C to +85°C
TCG Opal
LDPC + RAID ECC
1.5 million Hours
3 year

Applications

  • Networking
  • Industrial
  • Servers
  • POS
  • Embedded Computing
  • Boot up code and OS and application storage

M.2 PCIe GEN3 NVMe

Key Features

  • PCIe3 NVMe 1.3 Compliant
  • Industrial operation (-40°C to 85°C)
  • TCG Opal (Pyrite)
  • 3D TLC NAND Technology
  • End to End Data Protection:
  • Smart ECC LDPC + RAID ECC
  • High-performance Read/Write
  • LDPC & RAID Recovery for error correction
  • Dynamic Thermal Throttling
  • TRIM function

Benefits

  • Latest NAND Technology and controller
  • Reliability optimized for Embedded Applications
  • Cooler Operation under intense and heavy workload
  • Enterprise-Class designed for Embedded Applications
  • High capacity in a small form factor

Features & Performance

Interface
Compatibility
User Capacity
Form Factor
NAND Channel (#)
NAND Type
DRAM
Sequential Read/Write 128KB
Random Read/Write 4KB
HW PLP
PowerActive (Typ)
Features
Commercial Operating Temp
Industrial Operating Temp
Security
Error Correction
Uncorrectable Bit Error Rate (UBER) / Mean Time Between Failure (MTBF)
Warranty

Specifications

PCIe Gen3 NVMe
NVMe 1.3
2242: 128GB to 512GB
M.2 2242
x4
2D pSLC/SLC/3D TLC
DRAM-Less
2500/2100 MB/s
295K/439K IOPs
No
3.5W
Advanced Wear Leveling, TRIM, SMART, Data Loss Protection End to End Data
0°C to 70°C
-40°C to +85°C
TCG Opal 2.0, TCG Pyrite, AES-128/256 Encryption
LPC + RAID ECC
1 sector per 1016 bit read / 2 million hours
3 year

Applications

  • Server, Storage Cache/Accelerators
  • Networking Data Communications
  • Internal Storage with a Small Footprint
  • Industrial Control
  • Single-Board Computers for Medical and Industrial Control Application