PRODUCTS / EMBEDDED FLASH
M.2 SSD
Introduction
M.2 SSD brings ultra-thin and light storage devices to a long-awaited Embedded market. These Flash NAND solutions address applications that require reliable data storage to applications in Smart IoT, Industrial, Networking, Embedded, and provide a rugged, cost-effective and dependable non-volatile memory solution. The M.2 allows legacy SATA to convert to a form factor with no driver change. The M.2 PCIe access to PCIe Express lanes to take advantage of the high data transfer needed on next-generation computational systems.
M.2 SSD

M.2 SATA

M.2 PCIe GEN3 NVMe
M.2 SATA
Key Features
- Built-in Wear-Leveling and ECC
- Industrial operation (-40°C to 85°C)
- pSLC, SLC, MLC, and TLC NAND Technology for integrity
- Up to 1TB
- Three M.2 Form Factors: 2280, 2242
- Power Loss Protection
- S.M.A.R.T support for health monitoring
- TRIM support
- SLC caching and Direct to MLC mode
Benefits
- Data Reliability
- Optimized for Operation in Extreme Weather
- Enhanced Endurance
- Large Capacity
- Legacy or New design in support
- Data in Flight Integrity
Features & performance
Interface
Compatibility
User Capacity
Form Factor
NAND Channel (#)
NAND Type
Sequential Read/Write 128KB
Random Read/Write 4KB
HW PLP
PowerActive (Typ)
Features
Commercial Operating Temp
Industrial Operating Temp
Security
Error Correction
Mean Time Before Failure (MTBF)
Warranty
Specification
SATA III 6.0 Gb/s
SATA I, II, III Rev 3.2
pSLC: up to 256GB
SLC: up to 128GB
TLC: up to 512GB
SLC: up to 128GB
TLC: up to 512GB
M.2 2242
M.2 2280
M.2 2280
x8, x4
pSLC, TLC
560/520 MB/s
100K/90K IOPs
No
Yes (2242)
Yes (2242)
TBD
TRIM, Global Wear Leveling, End to End data path protection, SMART, Bad Block Management, Direct-to-TLC and SLC Caching
0°C to 70°C
-40°C to +85°C
TCG Opal
LDPC + RAID ECC
1.5 million Hours
3 year
Applications
- Networking
- Industrial
- Servers
- POS
- Embedded Computing
- Boot up code and OS and application storage
M.2 PCIe GEN3 NVMe
Key Features
- PCIe3 NVMe 1.3 Compliant
- Industrial operation (-40°C to 85°C)
- TCG Opal (Pyrite)
- 3D TLC NAND Technology
- End to End Data Protection:
- Smart ECC LDPC + RAID ECC
- High-performance Read/Write
- LDPC & RAID Recovery for error correction
- Dynamic Thermal Throttling
- TRIM function
Benefits
- Latest NAND Technology and controller
- Reliability optimized for Embedded Applications
- Cooler Operation under intense and heavy workload
- Enterprise-Class designed for Embedded Applications
- High capacity in a small form factor
Features & Performance
Interface
Compatibility
User Capacity
Form Factor
NAND Channel (#)
NAND Type
DRAM
Sequential Read/Write 128KB
Random Read/Write 4KB
HW PLP
PowerActive (Typ)
Features
Commercial Operating Temp
Industrial Operating Temp
Security
Error Correction
Uncorrectable Bit Error Rate (UBER) / Mean Time Between Failure (MTBF)
Warranty
Specifications
PCIe Gen3 NVMe
NVMe 1.3
2242: 128GB to 512GB
M.2 2242
x4
2D pSLC/SLC/3D TLC
DRAM-Less
2500/2100 MB/s
295K/439K IOPs
No
3.5W
Advanced Wear Leveling, TRIM, SMART, Data Loss Protection End to End Data
0°C to 70°C
-40°C to +85°C
TCG Opal 2.0, TCG Pyrite, AES-128/256 Encryption
LPC + RAID ECC
1 sector per 1016 bit read / 2 million hours
3 year
Applications
- Server, Storage Cache/Accelerators
- Networking Data Communications
- Internal Storage with a Small Footprint
- Industrial Control
- Single-Board Computers for Medical and Industrial Control Application